High-Density Multilayer, Double-sided PCB, FR-4 0.9mm, Halogen-Free Build for Consumer Applications suppliers manufacturers wholesale factory
dada
Description
Specifications/ Special Features:
Special features:
Layers: 1 to 22
Board thicknesses: 0.08-3.2mm
Materials: FR4, XPC, FR1, FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, rogers
Minimum line width: 3mil (0.075mm)
Minimum line spacing: 3mil (0.075mm)
Maximum panel sizes: SS-510×630, DS-558x635mm
Surface finish/treatments: OSP, lead-free HASL, ENIG, gold plating, immersion tin, immersion silver
Copper thicknesses: 0.5-3.0oz
Solder mask colors: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1 -mil)
Drilling: 0.2mm
PTH: ±0.08
NPTH: ±0.05
Certifications: UL, ISO 9001, ISO 14001, TS16949
Profiling: punching, routing, V-cut
- Layers: 1 to 22
- Board thickness: 0.08-3.2mm
- Materials: XPC, FR1, FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free, Rogers
- Minimum line width: 3mil (0.075mm)
- Minimum line spacing: 3mil (0.075mm)
- Maximum panel sizes: SS-510 x 630mm, DS-558 x 635mm
- Surface finish/treatments: OSP, lead-free HASL, ENIG, gold-plated, immersion tin, immersion silver
- Copper thickness: 0.5-3.0oz
- Solder mask colors: green/yellow/black/white/red/blue
- Copper thickness in hole: >25.0um (>1-mil)
- Drilling: 0.2mm
PTH: ±0.08
NPTH: ±0.05 - Certifications: UL, ISO 9001, ISO 14001, TS16949
- Profiling: punching, routing, V-cut
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